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    Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

    New search for: Maung Latt, K.
    New search for: Park, H. S.
    New search for: Li, S.
    New search for: Rong, L.
    New search for: Osipowicz, T.
    New search for: Zhu, W. G.
    New search for: Lee, Y. K.

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    Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

    New search for: Maung Latt, K.
    New search for: Park, H. S.
    New search for: Li, S.
    New search for: Rong, L.
    New search for: Osipowicz, T.
    New search for: Zhu, W. G.
    New search for: Lee, Y. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

    New search for: Maung Latt, K.
    New search for: Park, H. S.
    New search for: Li, S.
    New search for: Rong, L.
    New search for: Osipowicz, T.
    New search for: Zhu, W. G.
    New search for: Lee, Y. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

    Contributors:

    Maung Latt, K. (author) / Park, H. S. (author) / Li, S. (author) / Rong, L. (author) / Osipowicz, T. (author) / Zhu, W. G. (author) / Lee, Y. K. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 37 ; 1941-1949

    Publication date:

    2002-01-01

    Size:

    9 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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