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Measurement of Residual Stress Distribution of a Ground Silicon Nitride by Glancing Incidence X-Ray Diffraction Technique
Measurement of Residual Stress Distribution of a Ground Silicon Nitride by Glancing Incidence X-Ray Diffraction Technique
Measurement of Residual Stress Distribution of a Ground Silicon Nitride by Glancing Incidence X-Ray Diffraction Technique
Sakaida, Y. (author) / Tanaka, K. (author) / Harada, S. (author)
ADVANCES IN X RAY ANALYSIS ; 331-338
1997-01-01
8 pages
Article (Journal)
English
DDC:
539.7222
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