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    Measurement of Residual Stress Distribution of a Ground Silicon Nitride by Glancing Incidence X-Ray Diffraction Technique

    New search for: Sakaida, Y.
    New search for: Tanaka, K.
    New search for: Harada, S.

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    Measurement of Residual Stress Distribution of a Ground Silicon Nitride by Glancing Incidence X-Ray Diffraction Technique

    New search for: Sakaida, Y.
    New search for: Tanaka, K.
    New search for: Harada, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Measurement of Residual Stress Distribution of a Ground Silicon Nitride by Glancing Incidence X-Ray Diffraction Technique

    New search for: Sakaida, Y.
    New search for: Tanaka, K.
    New search for: Harada, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Measurement of Residual Stress Distribution of a Ground Silicon Nitride by Glancing Incidence X-Ray Diffraction Technique

    Contributors:

    Sakaida, Y. (author) / Tanaka, K. (author) / Harada, S. (author)

    Published in:

    ADVANCES IN X RAY ANALYSIS ; 331-338

    Publication date:

    1997-01-01

    Size:

    8 pages

    ISSN:

    0376-0308

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  539.7222

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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