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Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films

Jeon, I. / Park, Y. B. / Inoue, H. / Kishimoto, K.

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Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films

Jeon, I. / Park, Y. B. / Inoue, H. / Kishimoto, K.

Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films

Jeon, I. / Park, Y. B. / Inoue, H. / Kishimoto, K.

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Check availability in my library

Order at Subito €

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Document information

Title:

Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films

Contributors:

Jeon, I. (author) / Park, Y. B. (author) / Inoue, H. (author) / Kishimoto, K. (author) / Kishimoto, K. / Kikuchi, M. / Shoji, T. / Saka, M.

Published in:

Advances in Fracture and Failure Prevention ; 507-512

KEY ENGINEERING MATERIALS

Publication date:

2004-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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