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Effect of interface conditions on yield behavior of passivated copper thin films

Vinci, R. P. / Forrest, S. A. / Bravman, J. C.

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Effect of interface conditions on yield behavior of passivated copper thin films

Vinci, R. P. / Forrest, S. A. / Bravman, J. C.

Effect of interface conditions on yield behavior of passivated copper thin films

Vinci, R. P. / Forrest, S. A. / Bravman, J. C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of interface conditions on yield behavior of passivated copper thin films

Contributors:

Vinci, R. P. (author) / Forrest, S. A. (author) / Bravman, J. C. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 1863-1870

Publication date:

2002-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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