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    Review of Underfill Encapsulant Development and Performance of Flip Chip Applications

    New search for: Zoba, D.

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    Review of Underfill Encapsulant Development and Performance of Flip Chip Applications

    New search for: Zoba, D.

    Access

    Access via TIB
    Check availability in my library

    Review of Underfill Encapsulant Development and Performance of Flip Chip Applications

    New search for: Zoba, D.

    Access

    Access via TIB
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    Access

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    Document information
    Title:

    Review of Underfill Encapsulant Development and Performance of Flip Chip Applications

    Contributors:

    Zoba, D. (author)

    Published in:

    ADVANCING MICROELECTRONICS ; 23 ; 10-15

    Publication date:

    1996-01-01

    Size:

    6 pages

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.381

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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