A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
Lin, C.M. (author) / Chu, C.Y. (author) / Chang, W.L. (author)
MATERIALS SCIENCE FORUM ; 594 ; 163-168
2008-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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