Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip: Fid-Bau Portal

Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Shen, Y. K. / Lin, P. T. / Yeh, S. W.

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Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Shen, Y. K. / Lin, P. T. / Yeh, S. W.

Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Shen, Y. K. / Lin, P. T. / Yeh, S. W.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Contributors:

Shen, Y. K. (author) / Lin, P. T. (author) / Yeh, S. W. (author)

Published in:

JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 25 ; 1205-1214

Publication date:

2006-01-01

Size:

10 pages

ISSN:

0731-6844

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1923

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