Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Wafer-Bonding and Thinning Technologies

    New search for: Desmond-Colinge, C. A.
    New search for: Goesele, U.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Wafer-Bonding and Thinning Technologies

    New search for: Desmond-Colinge, C. A.
    New search for: Goesele, U.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wafer-Bonding and Thinning Technologies

    New search for: Desmond-Colinge, C. A.
    New search for: Goesele, U.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Wafer-Bonding and Thinning Technologies

    Contributors:

    Desmond-Colinge, C. A. (author) / Goesele, U. (author)

    Published in:

    MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 23 ; 30-34

    Publication date:

    1998-01-01

    Size:

    5 pages

    ISSN:

    0883-7694

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Damage-free Wafer Thinning

    Savastiouk, S. / Siniaguine, O. / Korczynski, E. | British Library Online Contents | 2000

    Wafer Thinning Techniques for Ultra-thin Wafers

    Reiche, M. / Wagner, G. | British Library Online Contents | 2003

    Wafer Thinning Manufacturing Issues in Memory Modules

    Koh, W. / Baldwin, E. | British Library Online Contents | 2004

    Thinning Silicon Wafer with Polycrystalline Diamond Tools

    Tso, P.L. / Chen, C.H. | British Library Online Contents | 2009

    Precision wafer thinning and its surface conditioning technique

    Young, H-T. / Lin, C-C. / Liao, H-T. et al. | British Library Online Contents | 2008

    Back to top