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    Wafer-Bonding and Thinning Technologies

    New search for: Desmond-Colinge, C. A.
    New search for: Goesele, U.

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    Wafer-Bonding and Thinning Technologies

    New search for: Desmond-Colinge, C. A.
    New search for: Goesele, U.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wafer-Bonding and Thinning Technologies

    New search for: Desmond-Colinge, C. A.
    New search for: Goesele, U.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Wafer-Bonding and Thinning Technologies

    Contributors:

    Desmond-Colinge, C. A. (author) / Goesele, U. (author)

    Published in:

    MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 23 ; 30-34

    Publication date:

    1998-01-01

    Size:

    5 pages

    ISSN:

    0883-7694

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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