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Thinning Silicon Wafer with Polycrystalline Diamond Tools

Tso, P.L. / Chen, C.H.

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Thinning Silicon Wafer with Polycrystalline Diamond Tools

Tso, P.L. / Chen, C.H.

Thinning Silicon Wafer with Polycrystalline Diamond Tools

Tso, P.L. / Chen, C.H.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thinning Silicon Wafer with Polycrystalline Diamond Tools

Contributors:

Tso, P.L. (author) / Chen, C.H. (author) / Xu, X.

Published in:

Progress in Abrasive and Grinding Technology ; 157-164

KEY ENGINEERING MATERIALS ; 404

Publication date:

2009-01-01

Size:

8 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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