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    Precision wafer thinning and its surface conditioning technique

    New search for: Young, H-T.
    New search for: Lin, C-C.
    New search for: Liao, H-T.
    New search for: Yang, M.

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    Precision wafer thinning and its surface conditioning technique

    New search for: Young, H-T.
    New search for: Lin, C-C.
    New search for: Liao, H-T.
    New search for: Yang, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Precision wafer thinning and its surface conditioning technique

    New search for: Young, H-T.
    New search for: Lin, C-C.
    New search for: Liao, H-T.
    New search for: Yang, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Precision wafer thinning and its surface conditioning technique

    Contributors:

    Young, H-T. (author) / Lin, C-C. (author) / Liao, H-T. (author) / Yang, M. (author)

    Published in:

    International journal of material & product technology ; 31 ; 36-45

    Publication date:

    2008-01-01

    Size:

    10 pages

    ISSN:

    0268-1900

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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