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Void nucleation in metal interconnects: Combined effects of interface flaws and crystallographic slip
Void nucleation in metal interconnects: Combined effects of interface flaws and crystallographic slip
Void nucleation in metal interconnects: Combined effects of interface flaws and crystallographic slip
Shen, Y.-L. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 14 ; 584-591
1999-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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