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    Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

    New search for: Wang, J.
    New search for: Zou, D.
    New search for: Lu, M.
    New search for: Ren, W.
    New search for: Liu, S.

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    Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

    New search for: Wang, J.
    New search for: Zou, D.
    New search for: Lu, M.
    New search for: Ren, W.
    New search for: Liu, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

    New search for: Wang, J.
    New search for: Zou, D.
    New search for: Lu, M.
    New search for: Ren, W.
    New search for: Liu, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

    Contributors:

    Wang, J. (author) / Zou, D. (author) / Lu, M. (author) / Ren, W. (author) / Liu, S. (author)

    Published in:

    ENGINEERING FRACTURE MECHANICS ; 64 ; 781-797

    Publication date:

    1999-01-01

    Size:

    17 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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