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    Vibration Reliability in Flip Chip Package

    New search for: Yeh, M. K.
    New search for: Zhong, W. X.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

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    Vibration Reliability in Flip Chip Package

    New search for: Yeh, M. K.
    New search for: Zhong, W. X.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Vibration Reliability in Flip Chip Package

    New search for: Yeh, M. K.
    New search for: Zhong, W. X.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Vibration Reliability in Flip Chip Package

    Contributors:

    Yeh, M. K. (author) / Zhong, W. X. (author) / Kim, Y.-J. / Bae, D.-H.

    Published in:

    Advances in Fracture and Strength ; 899-904

    KEY ENGINEERING MATERIALS ; 297/300

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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