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Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
Wade, N. (author) / Akuzawa, T. (author) / Kunii, J. (author) / Miyahara, K. (author)
KEY ENGINEERING MATERIALS ; 663-668
2000-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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