Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Zhang, Y. W. / Bower, A. F. / Xia, L. et al. | British Library Online Contents | 1999

In Situ SEM Observations of Electromigration Voids in Al Lines under Passivation

Flinn, P. A. / Madden, M. C. / Marieb, T. N. | British Library Online Contents | 1994

Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

Choi, Z.-S. / Monig, R. / Thompson, C.V. | British Library Online Contents | 2008

Annealing ambient on the evolution of He-induced voids in silicon

Li, B. S. / Zhang, C. H. / Zhong, Y. R. et al. | British Library Online Contents | 2011

Three-dimensional model for electromigration induced evolution of flip chip solder joints

Kim, D. | British Library Online Contents | 2009