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    Aging Behavior of Epoxy Molding Compound for Electronic Components in Hydrothermal Environment

    New search for: Zhang, J.-f.
    New search for: Liu, H.-c.
    New search for: Li, W.-p.

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    Aging Behavior of Epoxy Molding Compound for Electronic Components in Hydrothermal Environment

    New search for: Zhang, J.-f.
    New search for: Liu, H.-c.
    New search for: Li, W.-p.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Aging Behavior of Epoxy Molding Compound for Electronic Components in Hydrothermal Environment

    New search for: Zhang, J.-f.
    New search for: Liu, H.-c.
    New search for: Li, W.-p.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Aging Behavior of Epoxy Molding Compound for Electronic Components in Hydrothermal Environment

    Contributors:

    Zhang, J.-f. (author) / Liu, H.-c. (author) / Li, W.-p. (author)

    Published in:

    CORROSION AND PROTECTION -NANCHANG- ; 31 ; 103-106

    Publication date:

    2010-01-01

    Size:

    4 pages

    ISSN:

    1005-748X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11223

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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