Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections: Fid-Bau Portal

Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

Lee, J.-H. / Park, J.-H. / Lee, Y.-H. / Kim, Y.-S.

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Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

Lee, J.-H. / Park, J.-H. / Lee, Y.-H. / Kim, Y.-S.

Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

Lee, J.-H. / Park, J.-H. / Lee, Y.-H. / Kim, Y.-S.

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Check availability in my library

Order at Subito €

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Document information

Title:

Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

Contributors:

Lee, J.-H. (author) / Park, J.-H. (author) / Lee, Y.-H. (author) / Kim, Y.-S. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 1249-1251

Publication date:

2001-01-01

Size:

3 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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