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Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Chen, Y. J. / Yang, T. L. / Yu, J. J. / Kao, C. L. / Kao, C. R.

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Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Chen, Y. J. / Yang, T. L. / Yu, J. J. / Kao, C. L. / Kao, C. R.

Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Chen, Y. J. / Yang, T. L. / Yu, J. J. / Kao, C. L. / Kao, C. R.

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Check availability in my library

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Document information

Title:

Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Contributors:

Chen, Y. J. (author) / Yang, T. L. (author) / Yu, J. J. (author) / Kao, C. L. (author) / Kao, C. R. (author)

Published in:

MATERIALS LETTERS ; 110 ; 13-15

Publication date:

2013-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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