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    Electroless Copper Plating in the Presence of THPED and EDTA · 2Na as the Dual-Chelating Agent

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    Electroless Copper Plating in the Presence of THPED and EDTA · 2Na as the Dual-Chelating Agent

    New search for: Zheng, Y.-j.
    New search for: Zou, W.-h.
    New search for: Yi, D.-q.
    New search for: Gong, Z.-q.
    New search for: Li, X.-h.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Electroless Copper Plating in the Presence of THPED and EDTA · 2Na as the Dual-Chelating Agent

    New search for: Zheng, Y.-j.
    New search for: Zou, W.-h.
    New search for: Yi, D.-q.
    New search for: Gong, Z.-q.
    New search for: Li, X.-h.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Electroless Copper Plating in the Presence of THPED and EDTA · 2Na as the Dual-Chelating Agent

    Contributors:

    Zheng, Y.-j. (author) / Zou, W.-h. (author) / Yi, D.-q. (author) / Gong, Z.-q. (author) / Li, X.-h. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 39 ; 20-24

    Publication date:

    2006-01-01

    Size:

    5 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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