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    Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints

    New search for: Shepherd, D.
    New search for: Hagwood, C.
    New search for: Fields, R.

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    Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints

    New search for: Shepherd, D.
    New search for: Hagwood, C.
    New search for: Fields, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints

    New search for: Shepherd, D.
    New search for: Hagwood, C.
    New search for: Fields, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints

    Contributors:

    Shepherd, D. (author) / Hagwood, C. (author) / Fields, R. (author)

    Published in:

    JOURNAL OF TESTING AND EVALUATION ; 29 ; 380-386

    Publication date:

    2001-01-01

    Size:

    7 pages

    ISSN:

    0090-3973

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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