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    Strength of bonding interface in lead-free Sn alloy solders

    New search for: Kikuchi, S.
    New search for: Nishimura, M.
    New search for: Suetsugu, K.
    New search for: Ikari, T.
    New search for: Matsushige, K.

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    Strength of bonding interface in lead-free Sn alloy solders

    New search for: Kikuchi, S.
    New search for: Nishimura, M.
    New search for: Suetsugu, K.
    New search for: Ikari, T.
    New search for: Matsushige, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Strength of bonding interface in lead-free Sn alloy solders

    New search for: Kikuchi, S.
    New search for: Nishimura, M.
    New search for: Suetsugu, K.
    New search for: Ikari, T.
    New search for: Matsushige, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Strength of bonding interface in lead-free Sn alloy solders

    Contributors:

    Kikuchi, S. (author) / Nishimura, M. (author) / Suetsugu, K. (author) / Ikari, T. (author) / Matsushige, K. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A -LAUSANNE- ; 319-321 ; 475 - 479

    Publication date:

    2001-01-01

    Size:

    5 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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