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Scanning probe microscopy generated out-of-plane deformation maps exhibiting heterogeneous nanoscale deformation resulting from thermal cycling of Cu-polyimide damascene interconnects
Scanning probe microscopy generated out-of-plane deformation maps exhibiting heterogeneous nanoscale deformation resulting from thermal cycling of Cu-polyimide damascene interconnects
Scanning probe microscopy generated out-of-plane deformation maps exhibiting heterogeneous nanoscale deformation resulting from thermal cycling of Cu-polyimide damascene interconnects
Gross, T. S. (author) / Kamsah, N. b. (author) / Tsukrov, I. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 3560-3566
2001-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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