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Texture Investigation in Cu Damascene Interconnects during Annealing

Cho, J. Y. / Lee, H. J. / Kim, H. / Szpunar, J. A.

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Texture Investigation in Cu Damascene Interconnects during Annealing

Cho, J. Y. / Lee, H. J. / Kim, H. / Szpunar, J. A.

Texture Investigation in Cu Damascene Interconnects during Annealing

Cho, J. Y. / Lee, H. J. / Kim, H. / Szpunar, J. A.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Texture Investigation in Cu Damascene Interconnects during Annealing

Contributors:

Cho, J. Y. (author) / Lee, H. J. (author) / Kim, H. (author) / Szpunar, J. A. (author)

Published in:

MATERIALS SCIENCE FORUM ; 495/497 ; 1377-1382

Publication date:

2005-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Mirpuri, K. / Szpunar, J. A. / Kozaczek, K. | British Library Online Contents | 2002

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