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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu
Lee, T. Y. (author) / Choi, W. J. (author) / Tu, K. N. (author) / Jang, J. W. (author) / Kuo, S. M. (author) / Lin, J. K. (author) / Frear, D. R. (author) / Zeng, K. (author) / Kivilahti, J. K. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 291-301
2002-01-01
11 pages
Article (Journal)
English
DDC:
620.11
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