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    Intergranular cracking simulation of the intermetallic compound layer in solder joints

    New search for: An, T.
    New search for: Qin, F.

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    Intergranular cracking simulation of the intermetallic compound layer in solder joints

    New search for: An, T.
    New search for: Qin, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intergranular cracking simulation of the intermetallic compound layer in solder joints

    New search for: An, T.
    New search for: Qin, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Intergranular cracking simulation of the intermetallic compound layer in solder joints

    Contributors:

    An, T. (author) / Qin, F. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 79 ; 1-14

    Publication date:

    2013-01-01

    Size:

    14 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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