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    Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging

    New search for: Basaran, C.
    New search for: Tang, H.

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    Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging

    New search for: Basaran, C.
    New search for: Tang, H.

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    Access via TIB
    Check availability in my library
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    Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging

    New search for: Basaran, C.
    New search for: Tang, H.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging

    Contributors:

    Basaran, C. (author) / Tang, H. (author)

    Published in:

    INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 11 ; 87-108

    Publication date:

    2002-01-01

    Size:

    22 pages

    ISSN:

    1056-7895

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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