Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Damage mechanics of electromigration in microelectronics copper interconnects

    New search for: Basaran, Cemal
    New search for: Lin, Minghui

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Damage mechanics of electromigration in microelectronics copper interconnects

    New search for: Basaran, Cemal
    New search for: Lin, Minghui

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Damage mechanics of electromigration in microelectronics copper interconnects

    New search for: Basaran, Cemal
    New search for: Lin, Minghui

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Damage mechanics of electromigration in microelectronics copper interconnects

    Contributors:

    Basaran, Cemal (author) / Lin, Minghui (author)

    Published in:

    International journal of materials and structural integrity ; 1 ; 16-39

    Publication date:

    2007-01-01

    Size:

    24 pages

    ISSN:

    1745-0055

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects -

    Zschech, E. / Meyer, M. A. / Grafe, M. et al. | British Library Online Contents | 2004

    Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging

    Basaran, C. / Tang, H. | British Library Online Contents | 2002

    Electromigration in ULSI interconnects

    Tan, C. M. / Roy, A. | British Library Online Contents | 2007

    Electromigration and IC Interconnects

    Thompson, C. V. / Lloyd, J. R. | British Library Online Contents | 1993

    Damage mechanics of electromigration induced failure

    Basaran, C. / Lin, M. | British Library Online Contents | 2008

    Back to top