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Corrosion study at Cu-Al interface in microelectronics packaging

Tan, C. W. / Daud, A. R. / Yarmo, M. A.

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Corrosion study at Cu-Al interface in microelectronics packaging

Tan, C. W. / Daud, A. R. / Yarmo, M. A.

Corrosion study at Cu-Al interface in microelectronics packaging

Tan, C. W. / Daud, A. R. / Yarmo, M. A.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Corrosion study at Cu-Al interface in microelectronics packaging

Contributors:

Tan, C. W. (author) / Daud, A. R. (author) / Yarmo, M. A. (author)

Published in:

APPLIED SURFACE SCIENCE ; 191 ; 67-73

Publication date:

2002-01-01

Size:

7 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

Reuss, R. H. / Chalamala, B. R. | British Library Online Contents | 2003

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Why Microelectronics and Packaging? Wireless Applications

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Electromigration - a typical corrosion phenomenon in microelectronics

Schmitt-Thomas, K. G. / Wege, S. / Schweigart, H. | British Library Online Contents | 1995

Corrosion of parts used for microelectronics applications

Brand, U. J. / Buehler, H.-E. / Froehlich, T. et al. | British Library Online Contents | 1997