Effect of oxygen on the thermomechanical behavior of passivated Cu thin films: Fid-Bau Portal

Effect of oxygen on the thermomechanical behavior of passivated Cu thin films

Shu, J. B. / Clyburn, S. B. / Mates, T. E. / Baker, S. P.

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Effect of oxygen on the thermomechanical behavior of passivated Cu thin films

Shu, J. B. / Clyburn, S. B. / Mates, T. E. / Baker, S. P.

Effect of oxygen on the thermomechanical behavior of passivated Cu thin films

Shu, J. B. / Clyburn, S. B. / Mates, T. E. / Baker, S. P.

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Check availability in my library

Order at Subito €

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Document information

Title:

Effect of oxygen on the thermomechanical behavior of passivated Cu thin films

Contributors:

Shu, J. B. (author) / Clyburn, S. B. (author) / Mates, T. E. (author) / Baker, S. P. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 18 ; 2122-2134

Publication date:

2003-01-01

Size:

13 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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