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    Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling

    New search for: Hwang, S.-J.
    New search for: Park, H.
    New search for: Lee, J.-H.
    New search for: Oh, K. H.
    New search for: Joo, Y.-C.
    New search for: Lee, D. N.

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    Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling

    New search for: Hwang, S.-J.
    New search for: Park, H.
    New search for: Lee, J.-H.
    New search for: Oh, K. H.
    New search for: Joo, Y.-C.
    New search for: Lee, D. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling

    New search for: Hwang, S.-J.
    New search for: Park, H.
    New search for: Lee, J.-H.
    New search for: Oh, K. H.
    New search for: Joo, Y.-C.
    New search for: Lee, D. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling

    Contributors:

    Hwang, S.-J. (author) / Park, H. (author) / Lee, J.-H. (author) / Oh, K. H. (author) / Joo, Y.-C. (author) / Lee, D. N.

    Published in:

    Textures of Materials ICOTOM 13 Part 2 ; 1651-1656

    MATERIALS SCIENCE FORUM ; 408/412

    Publication date:

    2002-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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