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    Effects of Alloying in Near-Eutectic Tin-Silver-Copper Solder Joints

    New search for: Anderson, I. E.
    New search for: Cook, B. A.
    New search for: Harringa, J.
    New search for: Terpstra, R. L.
    New search for: Foley, J. C.
    New search for: Unal, O.

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    Effects of Alloying in Near-Eutectic Tin-Silver-Copper Solder Joints

    New search for: Anderson, I. E.
    New search for: Cook, B. A.
    New search for: Harringa, J.
    New search for: Terpstra, R. L.
    New search for: Foley, J. C.
    New search for: Unal, O.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Alloying in Near-Eutectic Tin-Silver-Copper Solder Joints

    New search for: Anderson, I. E.
    New search for: Cook, B. A.
    New search for: Harringa, J.
    New search for: Terpstra, R. L.
    New search for: Foley, J. C.
    New search for: Unal, O.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effects of Alloying in Near-Eutectic Tin-Silver-Copper Solder Joints

    Contributors:

    Anderson, I. E. (author) / Cook, B. A. (author) / Harringa, J. (author) / Terpstra, R. L. (author) / Foley, J. C. (author) / Unal, O. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 43 ; 1827-1832

    Publication date:

    2002-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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