The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints: Fid-Bau Portal

The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

Kang, S. K. / Lauro, P. / Shih, D.-Y. / Henderson, D. W. / Bartelo, J. / Gosselin, T. / Cain, S. R. / Goldsmith, C. / Puttlitz, K. / Hwang, T. K.

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The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

Kang, S. K. / Lauro, P. / Shih, D.-Y. / Henderson, D. W. / Bartelo, J. / Gosselin, T. / Cain, S. R. / Goldsmith, C. / Puttlitz, K. / Hwang, T. K.

The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

Kang, S. K. / Lauro, P. / Shih, D.-Y. / Henderson, D. W. / Bartelo, J. / Gosselin, T. / Cain, S. R. / Goldsmith, C. / Puttlitz, K. / Hwang, T. K.

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Title:

The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

Contributors:

Kang, S. K. (author) / Lauro, P. (author) / Shih, D.-Y. (author) / Henderson, D. W. (author) / Bartelo, J. (author) / Gosselin, T. (author) / Cain, S. R. (author) / Goldsmith, C. (author) / Puttlitz, K. (author) / Hwang, T. K. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 695-702

Publication date:

2004-01-01

Size:

8 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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