Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film (Express Regular Articles): Fid-Bau Portal

Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film (Express Regular Articles)

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

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Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film (Express Regular Articles)

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film (Express Regular Articles)

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

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Check availability in my library

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Title:

Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film (Express Regular Articles)

Contributors:

Chonan, Y. (author) / Komiyama, T. (author) / Onuki, J. (author) / Urao, R. (author) / Kimura, T. (author) / Nagano, T. (author)

Published in:

MATERIALS TRANSACTIONS ; 43 ; 1887-1890

Publication date:

2002-01-01

Size:

4 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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