Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system: Fid-Bau Portal

Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. / Park, M.-H. / Yoon, J.-W. / Jung, S.-B. / Ju, J.-S. / Yang, C.-W.

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Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. / Park, M.-H. / Yoon, J.-W. / Jung, S.-B. / Ju, J.-S. / Yang, C.-W.

Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. / Park, M.-H. / Yoon, J.-W. / Jung, S.-B. / Ju, J.-S. / Yang, C.-W.

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Title:

Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

Contributors:

Kang, H.-B. (author) / Lee, J.-W. (author) / Bae, J.-H. (author) / Park, M.-H. (author) / Yoon, J.-W. (author) / Jung, S.-B. (author) / Ju, J.-S. (author) / Yang, C.-W. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 2195-2201

Publication date:

2008-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2006

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

Nishikawa, H. / Komatsu, A. / Takemoto, T. | British Library Online Contents | 2008

Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Kumar, A. / Chen, Z. | British Library Online Contents | 2006

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Yoon, J. W. / Lee, C. B. / Jung, S. B. | British Library Online Contents | 2004

Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

Jang, D.M. / Yu, J. | British Library Online Contents | 2011