A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM: Fid-Bau Portal

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J. K. / Kang, H. B. / Lee, J. W. / Jung, S. B. / Yang, C. W.

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A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J. K. / Kang, H. B. / Lee, J. W. / Jung, S. B. / Yang, C. W.

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J. K. / Kang, H. B. / Lee, J. W. / Jung, S. B. / Yang, C. W.

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Title:

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Contributors:

Choi, J. K. (author) / Kang, H. B. (author) / Lee, J. W. (author) / Jung, S. B. (author) / Yang, C. W. (author) / Kang, S.-G. / Kobayashi, T.

Published in:

Designing, Processing and Properties of Advanced Engineering Materials PART 1 ; 405-408

MATERIALS SCIENCE FORUM ; 449/452

Publication date:

2004-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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