Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy: Fid-Bau Portal

Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy

Wang, L. / Yu, D. Q. / Zhao, J. / Huang, M. L.

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Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy

Wang, L. / Yu, D. Q. / Zhao, J. / Huang, M. L.

Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy

Wang, L. / Yu, D. Q. / Zhao, J. / Huang, M. L.

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Check availability in my library

Order at Subito €

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Document information

Title:

Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy

Contributors:

Wang, L. (author) / Yu, D. Q. (author) / Zhao, J. (author) / Huang, M. L. (author)

Published in:

MATERIALS LETTERS ; 56 ; 1039-1042

Publication date:

2002-01-01

Size:

4 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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