Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy
Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy
Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy
Wang, L. (Autor:in) / Yu, D. Q. (Autor:in) / Zhao, J. (Autor:in) / Huang, M. L. (Autor:in)
MATERIALS LETTERS ; 56 ; 1039-1042
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
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