Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages: Fid-Bau Portal

Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Zhang, F. / Li, M. / Chum, C. C. / Tu, K. N.

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Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Zhang, F. / Li, M. / Chum, C. C. / Tu, K. N.

Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Zhang, F. / Li, M. / Chum, C. C. / Tu, K. N.

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Check availability in my library

Order at Subito €

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Document information

Title:

Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Contributors:

Zhang, F. (author) / Li, M. (author) / Chum, C. C. (author) / Tu, K. N. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 2757-2760

Publication date:

2002-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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