Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mum-thick Cu under-bump metallization: Fid-Bau Portal

Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mum-thick Cu under-bump metallization

Nah, J.-W. / Chen, K. / Tu, K. N. / Su, B.-R. / Chen, C.

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Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mum-thick Cu under-bump metallization

Nah, J.-W. / Chen, K. / Tu, K. N. / Su, B.-R. / Chen, C.

Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mum-thick Cu under-bump metallization

Nah, J.-W. / Chen, K. / Tu, K. N. / Su, B.-R. / Chen, C.

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Check availability in my library

Order at Subito €

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Document information

Title:

Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mum-thick Cu under-bump metallization

Contributors:

Nah, J.-W. (author) / Chen, K. (author) / Tu, K. N. (author) / Su, B.-R. (author) / Chen, C. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 763-769

Publication date:

2007-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Chen, H.-Y. / Chen, C. | British Library Online Contents | 2010

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Lin, Y. H. / Tsai, C. M. / Hu, Y. C. et al. | British Library Online Contents | 2005

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Hu, Y. C. / Lin, Y. H. / Kao, C. R. et al. | British Library Online Contents | 2003

Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m. | British Library Online Contents | 2004

Three-dimensional model for electromigration induced evolution of flip chip solder joints

Kim, D. | British Library Online Contents | 2009