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Characterization of Die Stress in Flip Chip on Laminate Assemblies

Rahim, M. K. / Suhling, J. C. / Jaeger, R. C. / Johnson, R. W.

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Characterization of Die Stress in Flip Chip on Laminate Assemblies

Rahim, M. K. / Suhling, J. C. / Jaeger, R. C. / Johnson, R. W.

Characterization of Die Stress in Flip Chip on Laminate Assemblies

Rahim, M. K. / Suhling, J. C. / Jaeger, R. C. / Johnson, R. W.

Access

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Export, share and cite

Document information

Title:

Characterization of Die Stress in Flip Chip on Laminate Assemblies

Contributors:

Published in:

ADVANCING MICROELECTRONICS ; 30 ; 6-9

Publication date:

2003-01-01

Size:

4 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

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