Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder: Fid-Bau Portal

Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder

Hou, Z. / Tian, G. / Hatcher, C. / Johnson, R. W. / Yaeger, E. / Konarski, M. / Crane, L.

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Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder

Hou, Z. / Tian, G. / Hatcher, C. / Johnson, R. W. / Yaeger, E. / Konarski, M. / Crane, L.

Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder

Hou, Z. / Tian, G. / Hatcher, C. / Johnson, R. W. / Yaeger, E. / Konarski, M. / Crane, L.

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Document information

Title:

Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder

Contributors:

Hou, Z. (author) / Tian, G. (author) / Hatcher, C. (author) / Johnson, R. W. (author) / Yaeger, E. (author) / Konarski, M. (author) / Crane, L. (author)

Published in:

ADVANCING MICROELECTRONICS ; 29 ; 7-12

Publication date:

2002-01-01

Size:

6 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

Tu, K. N. / Zeng, K. | British Library Online Contents | 2001

Pajonk, J. / Halk, D. R. | British Library Online Contents | 2004

Shohji, I. / Shiratori, Y. / Yoshida, H. et al. | British Library Online Contents | 2004

Amalu, E. H. / Ekere, N. N. | British Library Online Contents | 2012

Jang, J.-W. / De Silva, A. P. / Lin, J.-K. et al. | British Library Online Contents | 2004