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    Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface

    New search for: Ma, X.
    New search for: Wang, F.
    New search for: Qian, Y.
    New search for: Yoshida, F.

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    Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface

    New search for: Ma, X.
    New search for: Wang, F.
    New search for: Qian, Y.
    New search for: Yoshida, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface

    New search for: Ma, X.
    New search for: Wang, F.
    New search for: Qian, Y.
    New search for: Yoshida, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface

    Contributors:

    Ma, X. (author) / Wang, F. (author) / Qian, Y. (author) / Yoshida, F. (author)

    Published in:

    MATERIALS LETTERS ; 57 ; 3361-3365

    Publication date:

    2003-01-01

    Size:

    5 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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