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Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging
Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging
Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging
Zhang, K.K. (author) / Li, C.Y. (author) / Qiu, R.F. (author) / Shi, H.X. (author) / Wang, Y.L. (author)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 28 ; 760-765
2012-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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