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    Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

    New search for: Wei, Z.
    New search for: Chunqing, W.
    New search for: Bohan, Y.

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    Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

    New search for: Wei, Z.
    New search for: Chunqing, W.
    New search for: Bohan, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

    New search for: Wei, Z.
    New search for: Chunqing, W.
    New search for: Bohan, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

    Contributors:

    Wei, Z. (author) / Chunqing, W. (author) / Bohan, Y. (author)

    Published in:

    RARE METAL MATERIALS AND ENGINEERING ; 35 ; 1143-1145

    Publication date:

    2006-01-01

    Size:

    3 pages

    ISSN:

    1002-185X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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