Characterizing the formation and growth of intermetallic compound in the solder joint

Lee, Y. G. / Duh, J. G. | British Library Online Contents | 1998

Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

Wei, Z. / Chunqing, W. / Bohan, Y. | British Library Online Contents | 2006

Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

Zhang, K.K. / Li, C.Y. / Qiu, R.F. et al. | British Library Online Contents | 2012

Nanomechanical responses of intermetallic phase at the solder joint interface - Crystal orientation and metallurgical effects

Song, J. M. / Huang, B. R. / Liu, C. Y. et al. | British Library Online Contents | 2012

Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

Fu, Y. / Zhang, Q. / Sun, F. et al. | British Library Online Contents | 2007