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Decrease in fatigue life of Sn-3.8 wt-%Ag-2 wt-%Cu alloy solder joints due to thermal cycling
Decrease in fatigue life of Sn-3.8 wt-%Ag-2 wt-%Cu alloy solder joints due to thermal cycling
Decrease in fatigue life of Sn-3.8 wt-%Ag-2 wt-%Cu alloy solder joints due to thermal cycling
Kato, H. (author) / Matsubara, K. (author) / Kageyama, K. (author)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 19 ; 1403-1410
2003-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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