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    Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

    New search for: Kato, H.
    New search for: Masaki, T.
    New search for: Kageyama, K.

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    Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

    New search for: Kato, H.
    New search for: Masaki, T.
    New search for: Kageyama, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

    New search for: Kato, H.
    New search for: Masaki, T.
    New search for: Kageyama, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

    Contributors:

    Kato, H. (author) / Masaki, T. (author) / Kageyama, K. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 17 ; 1306-1312

    Publication date:

    2001-01-01

    Size:

    7 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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