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    Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints

    New search for: Zafran, J. B.
    New search for: Sandor, B. I.

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    Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints

    New search for: Zafran, J. B.
    New search for: Sandor, B. I.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints

    New search for: Zafran, J. B.
    New search for: Sandor, B. I.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints

    Contributors:

    Zafran, J. B. (author) / Sandor, B. I. (author)

    Published in:

    JOURNAL OF TESTING AND EVALUATION ; 21 ; 346

    Publication date:

    1993-01-01

    Size:

    346 pages

    ISSN:

    0090-3973

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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