Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package

    New search for: Towashiraporn, P.
    New search for: Gall, K.
    New search for: Subbarayan, G.
    New search for: McIlvanie, B.
    New search for: Hunter, B. C.
    New search for: Love, D.
    New search for: Sullivan, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package

    New search for: Towashiraporn, P.
    New search for: Gall, K.
    New search for: Subbarayan, G.
    New search for: McIlvanie, B.
    New search for: Hunter, B. C.
    New search for: Love, D.
    New search for: Sullivan, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package

    New search for: Towashiraporn, P.
    New search for: Gall, K.
    New search for: Subbarayan, G.
    New search for: McIlvanie, B.
    New search for: Hunter, B. C.
    New search for: Love, D.
    New search for: Sullivan, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package

    Contributors:

    Towashiraporn, P. (author) / Gall, K. (author) / Subbarayan, G. (author) / McIlvanie, B. (author) / Hunter, B. C. (author) / Love, D. (author) / Sullivan, B. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FATIGUE ; 26 ; 497-510

    Publication date:

    2004-01-01

    Size:

    14 pages

    ISSN:

    0142-1123

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

    Kato, H. / Masaki, T. / Kageyama, K. | British Library Online Contents | 2001

    Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints

    Shohji, I. / Kobayashi, T. / Tohei, T. | British Library Online Contents | 2011

    Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method

    Lau, J. H. | British Library Online Contents | 1993

    Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

    Amalu, E. H. / Ekere, N. N. | British Library Online Contents | 2012

    Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

    Shohji, I. / Tohei, T. / Yoshizawa, K. et al. | British Library Online Contents | 2008

    Back to top