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    Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

    New search for: Shi, X. Q.
    New search for: Kwan, H. F.
    New search for: Nai, S. M.
    New search for: Lim, G. H.

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    Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

    New search for: Shi, X. Q.
    New search for: Kwan, H. F.
    New search for: Nai, S. M.
    New search for: Lim, G. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

    New search for: Shi, X. Q.
    New search for: Kwan, H. F.
    New search for: Nai, S. M.
    New search for: Lim, G. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

    Contributors:

    Shi, X. Q. (author) / Kwan, H. F. (author) / Nai, S. M. (author) / Lim, G. H. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 39 ; 1095-1099

    Publication date:

    2004-01-01

    Size:

    5 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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